TEC Modules

TEC Modules

• Thermoelectric materials – N&P crystal rods/ingots independently produced – crystal growth process, N&P third-generation hot extrusion process
• Autonomous cutting and processing of wafers and grains
• Wafer surface treatment: electroplating or chemical plating
• TEC automatic assembly, automatic paste printing, high-precision assembly process, reflow soldering

TEC Advantages:

• Precise temperature control, point-to-point refrigeration
• Seamless switching between refrigeration and heating
• Silent, vibration-free, environmentally friendly